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Company news
Phoenix Micromex 180 3D X-ray system arrived
Submitted by vision_jelenik on Sun, 10/28/2012 - 09:35
The microme|x is a high-resolution submicron X-ray system for the inspection of solder joints and electronic components.
Applications include:
Power electronics
Mounted printed circuit boards
Semiconductors and other electronic components
FEATURES:
Max. inspection area of 24“ x 22“
Detail detectability of <1µ
Max. tube voltage of 180 kV
Automated voiding calculation for multi-chip modules
Automated X-ray inspection of BGAs,CSPs,QFPs,QFNs,PTHs, Voiding Calculation, Wire Sweep
